South Korean biometrics firm Suprema received a patent in the country on April 10, related to the outer structure of fingerprint recognition modules.
There is limited information about the Korean-language patent, which is numbered 10-2015-0062473.
“This patent is a technology to simplify the structure of the terminal cover and to strengthen the waterproof structure,” writes a translation of the patent.
“The technology of this patent is applied to the fixed structure of our fingerprint recognition module and it will be utilized for future fingerprint recognition terminal.”
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